Modifications apportées à l'étape #18
Modifié par Alex Diaz-Kokaisl —
Modification approuvée par Alex Diaz-Kokaisl
- Avant
- Après
- Inchangé
Lignes de l'étape
| [title] Reassembly information | |
| - | [* icon_reminder] |
| + | [* icon_reminder] During reassembly, perform the following to clean the thermal paste: |
| [* black] Use the flat end of a spudger to scrape off the thermal paste on the bottom of the logic board. | |
| [* black] Clean any remaining thermal paste residue with isopropyl alcohol (>90%) and either a coffee filter or a lint-free cloth. | |
| [* black] Repeat the cleaning process for the thermal paste on the frame. | |
| - | [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] |
| + | [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] to reapply thermal paste to your device. |
| [* icon_note] When applying new thermal paste, use the flat end of a spudger to spread it evenly across the logic board. Try to match the original spread. |