Modifications apportées à l'étape #13
Modifié par Andrew Bookholt —
- Avant
- Après
- Inchangé
Lignes de l'étape
| + | [* black] After removing the screws and popping off the antenna, the mid-plane can be removed from the N8. |
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| + | [* icon_note] The design of the steel mid-plane is pretty genius. Nokia integrated a large EMI shield into the mid-plane to protect the main chips. In addition, thermal pads were placed on the inner face of the mid-plane to conduct heat away from the main chips. |
| + | [* icon_note] As processor speeds increase and devices become more integrated, the need for thermal management becomes critical to ensure longevity and operability in many environments. |
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