Modifications apportées à l'étape #2
Modifié par Adam Redmond —
Modification approuvée par Adam Redmond
- Avant
- Après
- Inchangé
Lignes de l'étape
| + | [* black] Using a soldering iron set at 400 degrees Celsius (752 degrees Fahrenheit), heat the solder joints lateral to the headphone jack. Use a pair of tweezers to lift the headphone jack from the board. |
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| + | [* icon_caution] Extreme caution should be taken when working with high-temperature equipment to reduce the chance of burns. |
| + | [* icon_note] It is strongly recommended that [guide|750|this guide on desoldering surface-mounted components] is referenced before proceeding. |