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Vue éclatée du Google Pixel 4 XL

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Traduction de l’étape 6

Étape 6
Google Pixel 4 XL Teardown: étape 0, image 1 de 2 Google Pixel 4 XL Teardown: étape 0, image 2 de 2
  • Side B of this record features:

  • Skyworks Sky5-8212-11 front-end module

  • Qualcomm QET5100 envelope tracker

  • Qualcomm PM8150 and PM8150A PMICs

  • STMicroelectronics ST54J NFC controller

  • Maxim MAX77826 companion PMIC

  • XSPT6 SMC85201 Z

  • Cirrus Logic CS35L36CWZ audio amplifier

Et sur la face B on trouve :

Skyworks Sky5-8212-11 module frontal

Qualcomm QET5100 envelope tracker

Qualcomm PM8150 et PM8150A PMICs

STMicroelectronics ST54J contrôleur NFC

XSPT6 SMC85201 Z

35L36CWZ BOCW1909

[* black] Side B of this record features:
[* red] Skyworks [https://www.skyworksinc.com/en/Products/Front-end-Modules/SKY58212-11|Sky5-8212-11] front-end module
[* orange] Qualcomm [https://www.qualcomm.com/news/releases/2018/02/14/qualcomm-continues-gigabit-lte-leadership-worlds-first-announced-2-gbps-lte|QET5100|new_window=true] envelope tracker
[* yellow] Qualcomm PM8150 and PM8150A PMICs
[* green] STMicroelectronics [https://www.st.com/content/st_com/en/products/secure-mcus/secure-nfc/st54j.html|ST54J|new_window=true] NFC controller
[* light_blue] Maxim MAX77826 [https://datasheets.maximintegrated.com/en/ds/MAX77829.pdf|companion PMIC|new_window=true]
[* blue] XSPT6 SMC85201 Z
- [* violet] 35L36CWZ BOCW1909
+ [* violet] Cirrus Logic CS35L36CWZ audio amplifier

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