Modifications apportées à l'étape #7
Modifié par Claire Miesch —
Modification approuvée par Claire Miesch
- Avant
- Après
- Inchangé
Lignes de l'étape
[* black] Et sur ce, c'est le moment de transmettre un peu de puce ID. Sur le devant de la carte mère, nous voyons : | |
[* red] SK Hynix [https://www.skhynix.com/static/filedata/fileDownload.do?seq=280|H9KNNNCTUMU-BRNMH] 4 Go LPDDR4 SDRAM posé sur le Qualcomm [https://www.qualcomm.com/products/snapdragon/processors/820|MSM8996]MSM8996 Snapdragon 820 | |
[* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE] 32 Go MLC Universal Flash Storage 2.0 | |
[* yellow] Module multibande multimode Avago AFEM-9040 | |
- | [* green] Module |
- | [* light_blue] Module Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064] high band RF Fusion et module [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A] |
+ | [* green] Module frontal Murata FAJ15 |
+ | [* light_blue] Module Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064] high band RF Fusion et module [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A] diversity receive |
[* blue] Codec Audio Qualcomm WCD9335 | |
[* violet] Maxim MAX77854 PMIC et MAX98506BEWV amplificateur audio |