Traduction de l’étape 8
Étape 8
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More chips inside this silicon sandwich include:
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Qualcomm PM8150 power management IC
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Qualcomm WCD9341 audio codec
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Samsung S2MIW04 power management
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Samsung S2DOS04 DC-DC converter (likely for the backlight)
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Qualcomm QDM3870 RF front-end module
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Samsung S2MPB02 power management IC
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Likely a Texas Instruments TAS2562 audio amplifier
| [* black] More chips inside this silicon sandwich include: | |
| - | [* red] Qualcomm PM8150 power management |
| - | [* orange] Qualcomm WCD9341 audio codec |
| - | [* yellow] |
| - | [* green] |
| + | [* red] Qualcomm PM8150 power management IC |
| + | [* orange] Qualcomm [link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec |
| + | [* yellow] Samsung S2MIW04 power management |
| + | [* green] Samsung S2DOS04 DC-DC converter (likely for the backlight) |
| [* light_blue] Qualcomm QDM3870 RF front-end module | |
| + | [* blue] Samsung S2MPB02 power management IC |
| + | [* violet] Likely a Texas Instruments [link|https://www.ti.com/product/TAS2562|TAS2562] audio amplifier |
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