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Vue éclatée du Samsung Galaxy Z Flip

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Étape 7
Samsung Galaxy Z Flip Teardown: étape 0, image 1 de 2 Samsung Galaxy Z Flip Teardown: étape 0, image 2 de 2
  • The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:

  • Samsung K3UH7H70AM-AGCL 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU

  • Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash

  • Broadcom AFEM-9106 front-end module

  • Skyworks SKY78160-51 Low Noise Amplifier

  • Qualcomm SDR8150 RF transceiver

  • Qualcomm WCN3998 WiFi + Bluetooth SoC

  • NXP Semiconductor PN80T NFC controller w/ Secure Element

Le Flip dispose d'une carte mère double-couche dense, également connue dans le monde de l’industrie comme circuit SLP. Nous avions déjà aperçu cette technologie gain de place dans l’iPhone X et plus récemment dans le Note10. Cela complique la vie aux experts en réparation de carte mère, mais permet aussi de caser plein de puces dans un espace minuscule.

925 K3UH7H7 Samsung (probablement 8 Go de RAM superposé sur la CPU Snapdragon 855)

949 KLUEG8UHDB Samsung (probablement les 256 Go de stockage Flash)

Module front-end AFEM-9106 Broadcom

Amplificateur de bruit 78160-51 Skyworks

Émetteur-récepteur RF SDR8150 Qualcomm

Système sur une puce (SoC) WiFi + Bluetooth WCN3998 Qualcomm

Contrôleur NFC 80T17 NXP

[* black] The Flip packs a dense, double-stacked motherboard—known in the industry as a [https://www.quick-pcba.com/pcb-news/substrate-like-pcb-technology.html|substrate-like PCB|new_window=true]. We first saw this space-saving technology in the [guide|98975|iPhone X|stepid=182892|new_window=true], and more recently in the [guide|125590|Note10|stepid=242798|new_window=true]. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:
- [* red] Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU)
- [* orange] Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage)
+ [* red] Samsung [link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM-AGCL|new_window=true] 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU
+ [* orange] Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash
[* yellow] Broadcom AFEM-9106 front-end module
- [* green] Skyworks 78160-51 low noise amplifier
+ [* green] Skyworks [link|https://store.skyworksinc.com/products/detail/sky7816051-skyworks/625141/|SKY78160-51|new_window=true] Low Noise Amplifier
[* light_blue] Qualcomm SDR8150 RF transceiver
- [* blue] Qualcomm WCN3998 WiFi + Bluetooth SoC
- [* violet] NXP 80T17 NFC controller
+ [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2018/02/21/qualcomm-introduces-industrys-first-integrated-80211ax-ready-solution|WCN3998|new_window=true] WiFi + Bluetooth SoC
+ [* violet] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T|new_window=true] NFC controller w/ Secure Element

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