Traduction de l’étape 7
Étape 7
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With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:
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SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM layered over the Qualcomm MSM8996 Snapdragon 820
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Samsung KLUBG4G1CE-B0B1 32 GB MLC Universal Flash Storage 2.0
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Avago AFEM-9040 Multiband Multimode Module
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Murata FAJ15 Front End Module
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Qorvo QM78064 high band RF Fusion Module and QM63001A diversity receive module
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Qualcomm WCD9335 Audio Codec
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Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier
| [* black] With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note: | |
| [* red] SK Hynix [https://www.skhynix.com/static/filedata/fileDownload.do?seq=280|H9KNNNCTUMU-BRNMH|new_window=true] 4 GB LPDDR4 SDRAM layered over the Qualcomm [https://www.qualcomm.com/products/snapdragon/processors/820|MSM8996|new_window=true] Snapdragon 820 | |
| - | [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE|new_window=true] 32 GB MLC Universal Flash Storage 2.0 |
| + | [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE-B0B1|new_window=true] 32 GB MLC Universal Flash Storage 2.0 |
| [* yellow] Avago AFEM-9040 Multiband Multimode Module | |
| [* green] Murata FAJ15 Front End Module | |
| [* light_blue] Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064|new_window=true] high band RF Fusion Module and [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A|new_window=true] diversity receive module | |
| [* blue] Qualcomm WCD9335 Audio Codec | |
| [* violet] Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier |
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