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华为 Mate 20 Pro 拆解

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Traduction de l’étape 10

Étape 10
Huawei Mate 20 Pro Teardown: étape 0, image 1 de 3 Huawei Mate 20 Pro Teardown: étape 0, image 2 de 3 Huawei Mate 20 Pro Teardown: étape 0, image 3 de 3
  • We use a pair of tweezers to dig out the last bits behind the motherboard.

  • The missing piece: a small interconnect board for the power and volume buttons. We find the following chips:

  • IDT P9221 wireless power receiver

  • Lattice Semiconductor iCE40LM1K-CM36 iCE40 FPGA

  • Cirrus Logic CS35L35A audio amplifier

  • Texas Instruments LM3644 1.5 A camera flash LED driver

  • With the Mate's brains dissected, it's time to head towards the other end of the phone and check out its fancy footwork.

我们用一把镊子拿出了藏在主板后的最后一块副板。

被遗忘的小角落:用于电源和音量按钮的小型互连板。我们找到了以下芯片:

LMIK36 B8283V26 PHIL

35L35A B1AG1527 SG

871 3644TI C37H

Mate的内在参观正式结束,现在开始观看它的外表。

[* black] We use a [product|IF145-060-3|pair of tweezers|new_window=true] to dig out the last bits behind the motherboard.
[* black] The missing piece: a small interconnect board for the power and volume buttons. We find the following chips:
- [* red] IDT P9221 1827SC SL-15 IDT [https://www.idt.com/document/dst/p9221-r-datasheet|wireless power receiver|new_window=true]
- [* orange] LMIK36 B8283V26 PHIL
- [* yellow] 35L35A B1AG1527 SG
- [* green] 871 3644TI C37H
+ [* red] IDT [link|https://www.idt.com/document/dst/p9221-r-datasheet|P9221|new_window=true] wireless power receiver
+ [* orange] Lattice Semiconductor [link|http://www.latticesemi.com/iCE40|iCE40LM1K-CM36|new_window=true] iCE40 FPGA
+ [* yellow] Cirrus Logic CS35L35A audio amplifier
+ [* green] Texas Instruments [link|https://www.ti.com/product/LM3644|LM3644|new_window=true] 1.5 A camera flash LED driver
[* black] With the Mate's brains dissected, it's time to head towards the other end of the phone and check out its fancy footwork.

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